Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads

Journal

Journal of Materials Engineering and Performance

Journal Volume

17

Journal Issue

1

Pages

134-140

Date Issued

2008

Author(s)

Chi, C.C.

Tsao, L.C.

Tsao, C.W.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1007/s11665-007-9151-y

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492004

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-38149092349&doi=10.1007%2fs11665-007-9151-y&partnerID=40&md5=5383b3ca2598d389bd409f27d25b389f

Type

journal article