Transient Thermal Performance of Electronic Cooling Module
Date Issued
2007
Date
2007
Author(s)
Wen, Chao-Chi
DOI
zh-TW
Abstract
近年來，電子設備元件之性能不斷提升，而其發熱功率亦隨著性能提升而逐漸增加，往往需要增加熱管或散熱鰭片的總面積和數目，導致增加品管的時間，降低生產效率。為此提供一種快速檢測的方法便是當務之急。
以系統識別搭配散熱模組進行動態分析研究。研究重點著重於(1)散熱模組的動態系統的識別。(2)提供兩種步階輸入訊號以觀察散熱模組的動態響應。(3)熱管燒乾現象的探討。(4)快速檢測方法的制定。
由識別結果得知，以成功建立散熱模組的動態模型，並提供均溫箱平台改善傳統加熱平台所產生接觸熱阻問題，透過快速檢測方法的制定可以將檢測時間縮短為30秒提升品管效率。
In recent years, the electronic devices and components have better performance constantly. With the increasing performance, the heat generation of the electronic devices and components also increases. It frequently needs to increase those numbers of total fin areas and heat pipes , and leads the lower efficiency of manufacture by raising quality control time. Therefore, looking for rapid quality control method plays an important role. The main purpose of the research presented is to study the dynamic behavior of the electronic cooling module by using system identify method. There are four main points in the research : (1) The dynamic system identify of the electronic cooling module. (2) Observing the dynamic response of the electronic cooling module by proving two step input single. (3) The analysis of the heat pipe under drying out situation. (4) Establish the rapid quality control method. From the system identify results, the investigation successfully establishs the dynamic model for the electronic cooling module and improves the thermal interface resistance’problem by using the constant temperature heating device. By the transient behavior test in thirty seconds , it can forecast the steady performance of the electronic cooling module for establishing rapid quality control method.
Subjects
熱管
嵌入式熱管散熱模組
系統識別
燒乾現象
Heat pipe
Cooling Module with Embedded Heat Pipe
Dry out
System Identify.
Type
thesis
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