Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-Wave Frequencies
Journal
Proceedings - Electronic Components and Technology Conference
Journal Volume
2021-June
Pages
577-582
Date Issued
2021
Author(s)
Abstract
Realization of Antenna-in-Package (AiP) needs to resolve several performance instability challenges at millimeter-wave (mmW) frequencies. They are caused by the uncertainties of material properties and mechanical fabrication limitations. In particular, the material properties are highly dependent on frequencies and may exhibit properties of magnetization. Besides, the physical sizes of wavelength at mmW frequencies are very small, making the discrepancy by mechanical fabrications large to cause degradation to the AiP's radiation performance. The roughness of the metal surface may also cause performance degradation, which cannot be avoided due to adherence to the dielectric substrates. These potential performance degradation factors arc examined in this paper by considering practical AiPs at 38 GHz bands. Comparisons between full-wave simulations and experimental measurements over AiP prototypes are performed to justify materials and fabrications' influencing factors. © 2021 IEEE
Subjects
Active antenna array; Antenna-in-package; Broadside radiation; End-fire radiation; Millimeter-wave frequency; The fifth generation of mobile communication
Other Subjects
5G mobile communication systems; Antenna arrays; Chip scale packages; Dielectric materials; Microstrip antennas; Microwave antennas; Millimeter waves; Surface roughness; Active antenna arrays; Antenna in packages; Broadside radiations; Dielectric substrates; End-fire; End-fire radiation; Fire radiation; Millimeter wave frequencies; Mobile communications; The fifth generation of mobile communication; Substrates
Type
conference paper