使用Cusil-ABA及MBF-51填料異質硬銲Crofer 22H與8YSZ
Other Title
Using the Cusil-ABA and MBF-51 Fillers to Braze Crofer 22H and 8YSZ
Journal
鑛冶：中國鑛冶工程學會會刊
Journal Volume
66
Journal Issue
1
Start Page
79
End Page
84
ISSN
0451-0011
Date Issued
2022-03
Author(s)
Abstract
本研究分別使用Cusil-ABA銀基活性填料（Ag-35.25Cu-1.75Ti, wt%）及非晶質MBF-51鎳基填料（Ni-15Cr-7.25Si-1.4B, wt%），將Crofer 22H合金與8YSZ陶瓷在真空下進行異質硬銲接合。Cusil-ABA在高真空（10^(-5) mbar）環境下銲點有少許裂紋。此外，Cusil-ABA填料與8YSZ界面上發現TiO_2反應層，故可藉由反應潤溼機構形成銲點。研究中亦使用未含活性元素之MBF-51填料在高真空（10^(-5) mbar）環境下進行潤濕性實驗。實驗結果顯示，MBF-51填料可良好潤濕Crofer 22H基材，但對8YSZ陶瓷之表面潤濕性不佳。MBF-51為非晶鎳基填料，雖然其化學組成未含有活性元素，但仍能在1150°C、10^(-5) mbar的條件下直接硬銲Crofer 22H與8YSZ，且填料與8YSZ界面上無連續裂紋。
Cusil-ABA silver-based active filler (Ag-35.25Cu-1.75Ti, wt%) and amorphous MBF-51 nickel-based filler (Ni-15Cr-7.25Si-1.4B, wt%) were used to vacuum brazing Crofer 22H alloy and 8YSZ ceramics in the study. There are a few cracks in the joint of Cusil-ABA after brazing in a high vacuum (10^(-5) mbar) environment. In addition, a TiO_2 reaction layer is observed at the interface between Cusil-ABA filler and 8YSZ, so the brazed joint can be formed by the reactive wetting mechanism. In the study, MBF-51 filler without active element was also used for wetting angle test in a high vacuum (10^(-5) mbar) environment. The experimental results show that MBF-51 filler can well wet the Crofer 22H substrate, but the surface wettability of 8YSZ ceramics is insifficient. MBF-51 is an amorphous nickel-based filler. Although its chemical composition does not contain active elements, it can still be directly brazing Crofer 22H and 8YSZ at 1150°C under 10-5 mbar. The brazed joint is free of any crack at the interface between the filler and 8YSZ.
Subjects
銀基活性填料
鎳基填料
異質硬銲
反應潤濕
顯微組織
silver-based active filler
nickel-based fillers
heterogeneous brazing
reactive wetting
microstructure
Type
journal article