SHEWMA: an End-of-line SPC Scheme Using Wafer Acceptance Test Data
Resource
IEEE Transactions on Semiconductor Manufacturing 13 (3): 344-357
Journal
IEEE Transactions on Semiconductor Manufacturing
Journal Volume
13
Journal Issue
3
Pages
344-357
Date Issued
2000-08
Date
2000-08
Author(s)
Abstract
In this paper, an end-of-line quality control scheme based on wafer acceptance test (WAT) data is presented. Due to the multiple-stream and sequence-disorder effects typically present in the WAT data, an abnormal process shift caused by one machine at an in-line step may become vague for detection using end-of-line WAT data. A methodology for generating robust design parameters for the simultaneous application of Shewhart and EWMA control charts to WAT data is proposed. This SHEWMA scheme is implemented in a foundry environment and its detection and diagnosis-enhancing capabilities are validated using both numerical derivations and fab data. Results show that the SHEWMA scheme is superior to the current practices in detection speed. Its use is complementary to the existing in-line SPC for process integration.
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