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College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
Testing Leakage Faults of Power TSV in 3D IC
Details
Testing Leakage Faults of Power TSV in 3D IC
Journal
IEEE Int’l workshop on 3D IC
Date Issued
2013-01
Author(s)
CHIEN-MO LI
Chi-Jih Shih
Shih-An Hsieh
Yi-Chang Lu
James Chien-Mo Li
Tzong-Lin Wu
K. Chakrabarty
CHIEN-MO LI
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/381716
Type
conference paper