具網路結合功能之半導體製造集結式機台─子計畫四：半導體集結式機台整合檢測與控制(3/3)
Other Title
Integrated Inspection and Control for Semiconductor Cluster Tools(3/3)
Date Issued
2001
Date
2001
Author(s)
DOI
892218E002055
Abstract
The goals of this three-year project are to develop
integrated inspection and control schemes for
semiconductor cluster tools, which include
off-line process optimization and on-line process
control techniques.
In the first year, we have developed rational
subgrouping technique for modeling the oxide
thickness non-uniformity of the rapid thermal
cluster tool. In the second year, we then
developed the on-line supervisory control
technique.
The tasks of the third year include: 1) to develop
integrated inspection and control methodology 2)
to construct an integrated inspection system
prototype and 3) to conduct data analysis.
Currently the tasks are all completed. The
proposed integrated inspection methodology is
developed and the equipment monitoring system
prototype is constructed. Time-series modeling
and multivariate statistics are used to model the
real-time equipment data for on-line monitoring
purpose.
Subjects
statistical process control
supervisory
control
control
real-time equipment monitoring
Publisher
臺北市：國立臺灣大學工商管理學系
Type
report
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