A Compact D -band Cavity-Backed Slot Antenna in Package (AiP) Implemented on Low-Cost Organic Substrate
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
Start Page
1
End Page
1
ISSN
2156-3985
2156-3950
Date Issued
2026-01-26
Author(s)
Abstract
This paper introduces a simple, compact, and low-profile D-band cavity-backed slot antenna-in-package (AiP) designed on a low-cost BT-based organic substrate. A 4 × 8 slot antenna array with a cavity backed is initially analyzed by a substrate integrated waveguide (SIW) feeding structure. In addition to the cavity-backed slot array, the full structure contains a coaxial-like vertical transition and a ground-signal-ground (GSG) probe pad to coaxial transition. The radiation patterns for the antenna fed via the SIW at the core layer and those fed through the low-loss transition from the GSG pad differ by less than 0.1 dBi in realized gain, confirming minimal insertion loss introduced by the transition. The antenna array is verified on a four-layer BT-based organic substrate within a compact footprint, with an electrical size of only 1.48 × 3.18 × 0.18 λ03. The antenna exhibits a peak realized gain of 12.2 dBi and a peak aperture efficiency of 28.1% at 155 GHz. The measured broadside realized gains above 10 dBi maintain across the 152–158 GHz range. The measured farfield results exhibit excellent agreement with the full-wave simulations, validating the accuracy and robustness of the proposed design. These results demonstrate the feasibility of the AiP structure using the low-cost BT-based substrate manufacturing technology as a promising solution for future D-band wireless communication applications.
Subjects
Antenna-in-package (AiP)
D-band
resonant cavity antenna
slot antenna
sub-THz
substrate integrated waveguide (SIW)
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Type
journal article