Numerical Simulation & Experimental Verification of Thermal Solution of Laptop Computer
Date Issued
2009
Date
2009
Author(s)
Wu, Hsiang-Tien
Abstract
The main idea of this work is to find a thermal solution for Qosmio-F50 laptop computer of Toshiba company by performing numerical simulation first, and then, by verifying the result of simulation by molding tool equipped with heater. The developed design has been implemented into the product to prove the performance. During the process of simulation, several things have been set up for the one-outlet and two-outlet designs individually, including the environmental conditions, the model setting and necessary parameters, the grid generation, and the solving procedure. Several simulations of critical modes of operation have been analyzed to find the simulation results. In the process of verification, two steps have to be accomplished, including the environmental conditions setting and the experimental tool setting. Under the one-outlet and two-outlet designs, several tests have been carried out for various critical modes of operation of the laptop computer to check with analytical results. From the results of analytical simulation and experimental verification, either one-outlet or two-outlet design will satisfy the thermal demand. However, the efficiency of one-outlet design is obviously better. In addition, because of the positioning problem of the heat pipe of CPU thermal module, two-outlet design will destroy the flow field inside the fan on one hand. Obviously, one-outlet design is a much better choice for cooling Qosmio-F50 laptop computer.
Subjects
numerical simulation
experimental verification
one-outlet design
two-outlet design
Type
thesis
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