A Novel Method for In-Situ Monitoring of the Thickness of a Silicon Wafer during Wet Etching

Resource

Sensors and Materials,18(2),71-82.

Journal

Sensors and Materials

Journal Volume

18

Journal Issue

2

Pages

71-82

Date Issued

2005-10

Date

2005-10

Author(s)

Lee, Chi Yuan

Chen, Yung Yu

Dai, Ching Liang

Wang, Xuan Yu

Chen, Ping Hei

Lee, Shuo Jen

URI

Type

journal article