Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
Resource
Journal of Electronic Materials,30(9),1152-1156.
Journal
Journal of Electronic Materials
Journal Volume
30
Journal Issue
9
Pages
1152-1156
Date Issued
2001-09
Date
2001-09
Author(s)
Liu, C. M.
Ho, C. E.
Chen, W. T.
Kao, and C. R.
Type
journal article