Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
Resource
Journal of Electronic Materials,31(6),584-590.
Journal
Journal of Electronic Materials
Journal Volume
31
Journal Issue
6
Pages
584-590
Date Issued
2002-06
Date
2002-06
Author(s)
Ho, C. E.
Tsai, R. Y.
Lin, Y. L.
Kao, and C. R.
Type
journal article