Optical Critical Dimension Metrology of HAR Micro and Sub-Micro Structures Using AI-Driven Optical Scatterometry for Advanced Semiconductor Packaging
Journal
Proceedings of SPIE - The International Society for Optical Engineering
Journal Volume
13704
Start Page
137040O
ISSN
0277786X
ISBN (of the container)
9781510693579
ISBN
9781510693579
Date Issued
2025
Author(s)
Editor(s)
Otani, Yukitoshi
Tutsch, Rainer
Yoshizawa, Toru
Abstract
This article introduces an AI-driven optical scatterometry method with global sensitivity analysis (GSA) for OCD metrology in semiconductor sub-micron structures. It addresses challenges in measuring sub-micron high aspect ratio (HAR) features by integrating variance-based global sensitivity analysis (GSA) with deep ultraviolet (DUV) and short-wave infrared (SWIR) scatterometry, achieving less than 3% errors compared to AFM and SEM, and proving reliable for HAR metrology.
Event(s)
Optical Technology and Measurement for Industrial Applications Conference 2025, Yokohama, 21 April 2025 - 25 April 2025
Subjects
global sensitivity analysis (GSA)
high aspect ratio (HAR)
optical critical dimension (OCD)
Scatterometry
semiconductor advanced packaging
semiconductor metrology
Publisher
SPIE
Type
conference paper