Interfacial reactions and electromigration in flip-chip solder joints

Journal

Advanced Flip Chip Packaging

Pages

503-560

ISBN

9781441957689

1441957677

9781441957672

Date Issued

2013

Author(s)

Ho C.E.

Kao C.R.

Tu K.N.

DOI

10.1007/978-1-4419-5768-9_11

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84907657767&doi=10.1007%2f978-1-4419-5768-9_11&partnerID=40&md5=7bcb80a7a4ccb7cd1fa05380c971fda7

https://scholars.lib.ntu.edu.tw/handle/123456789/432624

SDGs

[SDGs]SDG10

Publisher

Springer US

Type

book part