Reflectionless design for differential via transitions using neural network-based approach

Journal

IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging

Pages

143-146

Date Issued

2007-10

Author(s)

Y. S. Jeng

W. D. Guo

G. H. Shiue

C. M. Lin

DOI

10.1109/EPEP.2007.4387145

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/333554

Type

conference paper