Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Resource

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2(6), 979-984

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal Volume

2

Journal Issue

6

Pages

979-984

Date Issued

2012

Date

2012

Author(s)

Chang, Jing-Yao

Cheng, Ren-Shin

Kao, Kuo-Shu

Chang, Tao-Chih

DOI

URI

Type

journal article

File(s)

Name

26.pdf

Size

23.43 KB

Format

Adobe PDF

Checksum

(MD5):4c74432a1c646755b42e02cb30dc6559