無鉛銲錫球格陣列構裝製程與可靠度分析─總計畫(III)
Date Issued
2003
Date
2003
Author(s)
DOI
912216E002036
Abstract
Through the group studies including
the manufacturing process, interfacial
reaction kinetics and failure analysis, the
prediction model of failure life for Pb-free
solder joints of BGA packages with Au/Ni
surface finish. In addition, using the
electrical analysis for packaging modulus
more direct information can be obtained.
Accompanying with the metallographic
observations, the intermetallics growth,
microstructure change, crack nucleation and
propagation of solder joints are investigated.
Finally, the probability and statistics theory
are employed to evaluate the reliability of
the whole packaging system, which result in
the clarification of failure life distribution
and the prediction of failure life.
Subjects
Pb-free solder
BGA
thermal cycling
dynamic fatigue tests
electrical analysis.
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
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