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Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
Resource
Journal of Electronic Materials 35 (7): 1566-1570
Journal
Journal of Electronic Materials
Journal Volume
35
Journal Issue
7
Pages
1566-1570
Date Issued
2006
Date
2006
Author(s)
Type
journal article
File(s)
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Name
100.pdf
Size
188.41 KB
Format
Adobe PDF
Checksum
(MD5):754c1f218b12247cee07273bcc198281