Thermal stress aware design for stacking IC with through glass via
Journal
International Microsystems, Packaging, Assembly, and Circuits Technology Conference
Pages
133-136
Date Issued
2012
Author(s)
Chien, J.-H.
Yu, H.
Lung, C.-L.
Chang, H.-C.
Tsai, N.-Y.
Chou, Y.-F.
Chen, P.-H.
Chang, S.-C.
Kwai, D.-M.
Type
conference paper