Accurate Warp Prediction of Electronic Packaging During a Sequential Manufacturing Process by Measurement and Simulation Analysis
Date Issued
2007
Date
2007
Author(s)
Chen, Chi-Sung
DOI
zh-TW
Abstract
A mechanical model followed a sequential manufacturing process was considered in order to simulate the warpage during a sequential steps of the assembly of a plastic encapsulated ball grid arrays (BGA) package, such as die attachment, encapsulation, and solder reflow process. A chip in substrate package, which including die attachment, resin coated copper (RCC) lamination, structuring, pre-metallization, metallization, patterning, solder mask curing, solder opening and solder reflow was used as a model IC package. Experimental measurement analysis (EMA) of the thermal residual warp field of the substrate caused by the coefficient of thermal expansion (CTE) mismatch among these materials in processes are employed to validate models of finite element analysis (FEA) by the shadow moiré with phase stepping technique. Failure to incorporate chemical shrinkage of epoxy molding compound (EMC) or residual warp field of a sequential process into the numerical analysis leads to erroneous predictions of the warp behavior. With the help of the experimental measurements carried about the befitting level of sensitivity, and together with the numerical simulation which takes into account of the effects of chemical shrinkage of EMC and residual warp field of a sequential process, engineers will be able to predict residual warps as well as stresses field for every manufacturing process.
Subjects
塑封球柵陣列構裝
基板內埋晶片構裝
相移陰影疊紋量測系統
plastic encapsulated ball grid arrays (BGA)
chip in substrate package
a sequential manufacturing process
Type
thesis
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