Influence of grinding process on semiconductor chip strength

Resource

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

Journal

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

Pages

-

Date Issued

2002-05

Date

2002-05

Author(s)

Wu, Enboa

Shih, I.G.

Chen, Y.N.

Chen, S.C.

Tsai, C.Z.

Shao, C.A.

DOI

10.1109/ECTC.2002.1008323

DOI

0569-5503

URI

http://ntur.lib.ntu.edu.tw//handle/246246/2007041910021175

Type

other

File(s)

Name

01008323.pdf

Size

744.23 KB

Format

Adobe PDF

Checksum

(MD5):737baa78c81f0bd4128cd4b13c18ee62