An Experimental Investigation on Silicon Wafer Thinning Process
Resource
Journal of the Chinese Society of Mechanical Engineers,29(5),405-412.
Journal
Journal of the Chinese Society of Mechanical Engineers
Journal Volume
29
Journal Issue
5
Pages
405-412
Date Issued
2008
Date
2008
Author(s)
Lin, C.C.
Young, H.T.
Zhan, J.P.
Type
journal article