Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
Resource
Journal of Materials Science: Materials in Electronics, 22(8), 1181-1187
Journal
Journal of Materials Science Materials in Electronics
Pages
1181-1187
Date Issued
2011
Date
2011
Author(s)
Wu, R.W.
Tsao, L.C.
Chang, S.Y.
Jain, C.C.
Chen, R.S.
Type
journal article
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158.pdf
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Format
Adobe PDF
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