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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Time-domain SPICE model for coupled interconnects using the multi-conductor layer peeling technique
Details
Time-domain SPICE model for coupled interconnects using the multi-conductor layer peeling technique
Journal
Int. Zurich Symp. Technical Exhibit. Electromagn. Compat.
Pages
5-10
Date Issued
2003-02
Author(s)
C.-C. Kuo
TZONG-LIN WU
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/304258
Type
conference paper
