Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Resource

Materials & Design, 32(10), 4720-4727

Journal

Materials & Design (1980-2015)

Pages

4720-4727

Date Issued

2011

Date

2011

Author(s)

Chang, S.Y.

Jain, C.C.

Chuang, T.H.

Feng, L.P.

DOI

URI

Type

journal article

File(s)

Name

113.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):147a7f2c33859f46b546a01ce75ee5e2