Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate

Resource

Journal of Materials Engineering and Performance 11 (4): 365-368

Journal

Journal of Materials Engineering and Performance

Journal Volume

11

Journal Issue

4

Pages

365-368

Date Issued

2002

Date

2002

Author(s)

Su, T. L.

Tsao, L. C.

Chang, S. Y.

Chuang, T. H.

URI

Type

journal article

File(s)

Name

77.pdf

Size

329.96 KB

Format

Adobe PDF

Checksum

(MD5):0563b3297a3c719a62ac0f1af87a32ad