Interfacial Reactions of Wire-bonded Gold Bumps with Aluminu Pads in Flip Chip Assembly
Date Issued
2007
Date
2007
Author(s)
Liu, Yu-Chih
DOI
zh-TW
Abstract
The effort of this study is to comprehend the interfacial reaction of gold bump and aluminum pad. Thermosonic bonding combines the ultrasonic bonding and thermo-compression bonding. In the process of bonding, substrates maintain 150~250℃. This bonding temperature affects the growth of IMC, especially when the bonding lasts longer. Furthermore, Pb-free technology needs higher process temperatures which may cause joints failure. In this study, we will investigate Au/Au joints and Au/Al joints.
According to this study, Au/Au joints all break in the gold solder and their strength doesn’t change with time. However, there are different sorts of failure modes in Au/Al joints. These failure modes affect the ball shear strength. Au/Al joints break in the lower temperature due to the cratering effect and break in the higher temperature due to the Kirkendall voids. In this research, we use TEM , SEM , OM and AES to investigate intermetallic compound .
Subjects
覆晶組裝
打線接合
界面反應
Flip Chip
Wire Bond
Interfacial reaction
Type
thesis
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