Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices

Sintered silver paste is widely used as the die-attachment material for power semiconduc-tors. However, sintered silver joints encounter problems, such as severe coarsening of sintered pores and oxidation issues, in harsh high-temperature environments. These lead to the deterioration of the die-attachment joints. In this paper, a novel method of sintering silver joints is demonstrated, where silver–indium alloy paste is used to improve the reliability of sintered Ag joints. The silver– indium (Ag–In) alloy paste was fabricated through mechanical alloying using the ball-milling tech-nique. The well-bonded sintered Ag–In alloy joints inhibited pore coarsening better than pure sin-tered Ag joints and significantly enhanced the mechanical properties at high operating tempera-tures. Lastly, an oxidation mechanism for the sintered joint was proposed, and strategies to prevent such high-temperature oxidation were discussed. © 2022 by the authors. Licensee MDPI, Basel, Switzerland.