Micro/nano hierarchical structure in microchannel heat sink for boiling enhancement
Journal
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages
285-288
Date Issued
2012
Author(s)
Abstract
Uniform SiNW structures were fabricated for the first time on the top, bottom and sidewall surfaces of microchannel heat sinks by using a two-step electro-less etching process. The micro/nano hierarchical structure yields superior boiling heat transfer performance. Its maximum heat flux is improved by 150% over the microchannel-only heat sink and 400% over a plain silicon surface. These results provide a new insight into the boiling mechanism for microchannel heat sinks using hierarchical structures.
SDGs
Type
conference paper