Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecture

Journal

Journal of Electronic Packaging, Transactions of the ASME

Journal Volume

137

Journal Issue

3

Date Issued

2015

Author(s)

Chang, J.-Y.

Huang, S.-Y.

Lee, C.-C.

Chuang, T.-H.

Chang, T.-C.

TUNG-HAN CHUANG

DOI

10.1115/1.4030392

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491966

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84930196328&doi=10.1115%2f1.4030392&partnerID=40&md5=4ceb35fee89975d7871ac78b12835e35

Type

journal article