Measurement and development of a bipolar electrostatic chuck in serial plasma processes
Date Issued
2005
Date
2005
Author(s)
lin, Chih-lung
DOI
zh-TW
Abstract
The bipolar electrostatic chuck for silicon wafers has been developed for used in serial plasma process. The advantage of the bipolar electrostatic chuck is that attractions appear without plasma, so we take advantage of it in industry gradually. The bipolar electrostatic chuck’s proper proportion between the top plate and the bottom plate, material of plates, roughness of plate’s surface, marking of plate’s surface, the choice of the gelatin, the disposal of helium’s pressure between the wafer and the bipolar electrostatic chuck and the rear of the bipolar electrostatic chuck’s cooling water design affect the quality of the bipolar electrostatic chuck importantly.
In the experiment, the aluminum material is used for the bipolar electrostatic chuck , and hard anodizing is applied to aluminum to build the first dielectric layer. The proper proportion between the top plate and the bottom plate of the bipolar electrostatic chuck is effectively uniformly distributed by the reciprocative electrostatic attraction. The low dilation coefficient, the low dielectric coefficient, the high thermal coefficient and the strong binding are the main factors in the choice of the gelatin. The gelatin, which is a kind of Epoxy is used to build the second dielectric layer. We build the high density plasma’s test stage which is built by Visual Basic that is a software interface, high sensitivity sensor that is a hardware interface and RS-232 that is a message interface. The stage tests the bipolar electrostatic chuck’s abilities of suction, delivery and cooling. We can find some key points in the experiment. When the working voltage is less than the breakdown voltage, there is a direct proportion between suction and working voltage. When the resistivity of the bipolar electrostatic chuck’s dielectric layer is lower, the time of suction and the time of dechucking is shorter. Better roughness of surface yields better thermal efficiency and lower resistivity of dielectric layers. From the data of the experiments, we can give the bipolar electrostatic chuck a better design principle, and we can also provide manufacturers a test stage that can be used to produce better quality products.
Subjects
雙極性
靜電
吸盤
電漿
極性
ESC
Electrostatic Chuck
plasma
Type
thesis
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