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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)
Details
The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)
Journal
2013 e-Manufacturing and Design Collaboration Symposium
Date Issued
2013
Author(s)
Liao, M.-H.
Chen, C.-H.
Lee, J.J.
Chen, K.C.
JYH-JONE LEE
DOI
10.1109/eMDC.2013.6756038
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-84898041415&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/378696
Type
conference paper