Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads

Resource

Journal of Electronic Materials 35 (3): 471-478

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

3

Pages

471-478

Date Issued

2006

Date

2006

Author(s)

Chi, Chih-Chien

URI

Type

journal article

File(s)

Name

97.pdf

Size

591.68 KB

Format

Adobe PDF

Checksum

(MD5):e589035e59b28fc659b385cdaeb58899