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Pin Grid Array Routing for MCM (III)
Date Issued
1999-07-31
Date
1999-07-31
Author(s)
DOI
882216E002017
Abstract
The research plan is three-years based.
We have already developed an MCM PGA
packaging router at the first year and finished
the following phases: layer assignment,
topological routing, and geometric routing.
At the second year, we have also developed
an MCM BGA packaging router. At this year,
the overall design will be divided into the
following phrases: (i) Implant the MCM PGA
and BGA package routers from Sun
Workstation to Windows environment and
platform. (ii) Integrate and test our packaging
routers with the other MCM subsystem. Our
PGA and BGA package routers couple tightly
with other subprojects, and can be integrated
into other MCM systems developed by our
CAD research groups.
We have already developed an MCM PGA
packaging router at the first year and finished
the following phases: layer assignment,
topological routing, and geometric routing.
At the second year, we have also developed
an MCM BGA packaging router. At this year,
the overall design will be divided into the
following phrases: (i) Implant the MCM PGA
and BGA package routers from Sun
Workstation to Windows environment and
platform. (ii) Integrate and test our packaging
routers with the other MCM subsystem. Our
PGA and BGA package routers couple tightly
with other subprojects, and can be integrated
into other MCM systems developed by our
CAD research groups.
Publisher
臺北市:國立臺灣大學電機工程學系暨研究所
Coverage
計畫年度:88;起迄日期:1998-08-01/1999-07-31
Type
report
File(s)
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Name
882216E002017.pdf
Size
359.71 KB
Format
Adobe PDF
Checksum
(MD5):ff5886a488c3dc0bf1c4ec9e9002d340