Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints

Journal

Journal of Electronic Materials

Journal Volume

33

Journal Issue

12

Pages

1424-1428

Date Issued

2004

Author(s)

Tsai C.M.

Luo W.C.

Chang C.W.

Shieh Y.C.

DOI

10.1007/s11664-004-0082-1

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-11344255513&doi=10.1007%2fs11664-004-0082-1&partnerID=40&md5=aaa6731835481f3efaba680171c381e0

https://scholars.lib.ntu.edu.tw/handle/123456789/432721

Publisher

Minerals, Metals and Materials Society

Type

journal article