Intermetallic compounds formed at the interface between liquid indium and copper substrates

Journal

Journal of Electronic Materials

Journal Volume

31

Journal Issue

5

Pages

488-493

Date Issued

2002

Author(s)

Yu, C.L.

Wang, S.S.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-002-0104-9

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492033

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036575619&doi=10.1007%2fs11664-002-0104-9&partnerID=40&md5=5219a98bc0ae0a3eb8ba5e3c1910983e

Type

journal article