Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy
Resource
Metallurgical and Materials Transactions A, 42(3), 684-691
Journal
Metallurgical and Materials Transactions A
Pages
684-691
Date Issued
2011
Date
2011
Author(s)
Jain, Chao-Chi
Abstract
Rapid growth of tin whiskers has been observed on the surface of rosette-shaped NdSn3 intermetallic phase in a Sn-3Ag-0.5Cu-0.5Nd alloy after air storage. It is shown that various cross sections of NdSn 3 rosettes in the solder matrix reveal different morphologies of tin whiskers, which can be classified as four types: long fibers, short fibers, tiny sprouts, and hillocks. The fibrous whiskers and tiny sprouts are found on the surfaces of specimens exposed to air at room temperature and 423 K (150 °C), while hillocks appear only after storage at 423 K (150 °C). In addition, it is observed that, in most cases, each oxidized NdSn3 intermetallic phase contains only a single whisker at its center. Through metallographic observations and chemical analyses on the cross sections of the oxidized NdSn3 intermetallics, a "successive compressive stress model" has been proposed to interpret the tin whisker growth on the surface of a rare earth (RE)-containing solder. © 2010 The Minerals, Metals & Materials Society and ASM International.
Type
journal article
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