Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers

Journal

Journal of Electronic Materials

Journal Volume

32

Journal Issue

9

Pages

952-956

Date Issued

2003

Author(s)

Liang, M.W.

Hsieh, T.E.

Chang, S.Y.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-003-0229-5

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492024

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0141676003&doi=10.1007%2fs11664-003-0229-5&partnerID=40&md5=87cfa6df6547d12a872772f8d6d4ec71

Type

journal article