Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections
Journal
Materials Letters
Journal Volume
110
Pages
13-15
Date Issued
2013
Author(s)
Abstract
This study reports the re-emergence of the classical Au and Pd embrittlement problems in micro joints in three-dimensional integrated circuits (3D ICs) applications. Our results indicate that (Au,Pd,Ni)Sn4 can form a continuous layer across entire joints even if the Au and Pd layers are very thin. This morphology is detrimental to the joint reliability. This study shows that it is practically impossible to avoid these embrittlement problems simply by reducing the thickness of Au or Pd layers when the micro joints are smaller than 10 μm. An effective solution to eliminate such embrittlement problems is to introduce relatively large amounts of Cu to the micro joints. © 2013 Elsevier B.V.
SDGs
Type
journal article