Effect of Plating Temperature on the Crystallization and Texture Development of Highly (111) Oriented Electroless Cu Nanotwins
Journal
2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Part Of
Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Start Page
343
End Page
346
Date Issued
2024-10-22
Author(s)
Abstract
This study achieved a significant milestone by fabricating a highly (111) textured electroless nanotwinned Cu (nt-Cu) film in columnar grains with specific additives in the electroless plating bath. Moreover, the study found that the plating temperature plays a crucial role in Cu nanotwins' crystallization and texture development. Even a 5-degree Celsius difference in plating temperature can significantly influence the twinning fraction, (111) texture development, and the formed twin coherency within the Cu film. The crystallization of (111) textured Cu nanotwins in columnar grains along the growth direction was much favored at a lower plating temperature of 40 °C. This lower temperature led to 88% of the deposited Cu nanotwins exhibiting a (111) textured orientation. This high percentage indicates a strong influence of the plating temperature on the texture development. Additionally, the electroless nanotwins deposited at 40 °C had higher coherency. The Cu film comprised up to 40% of S 3 111 of the total grain boundaries, indicating that the formed grains are organized in a more energy-stable lattice arrangement. The highly (111) textured and more coherent nanotwinned structure contributes to grain boundary strengthening, revealing the electroless nt-Cu film as a promising engineering material.
Event(s)
19th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2024, Taipei, 22 October 2024 through 25 October 2024. Code 205827
Subjects
Copper
Copper plating
Grain growth
Metallic films
Columnar grain
Cu films
Electroless
Grain-boundaries
Growth directions
Lows-temperatures
Nanotwinned
Nanotwins
Plating bath
Texture development
Electroless plating
Publisher
IEEE
Type
conference paper