Electrical Characteristics of Bend Discontinuity and Compensation Design
Date Issued
2007
Date
2007
Author(s)
Lin, Yu-Sen
DOI
zh-TW
Abstract
As the data rates increase into the multi-gigabit range, the effect of bend discontinuities on printed circuit board becomes non-negligible. this paper utilizes the commercial electromagnetic field solver to extract Z-parameters of the bend discontinuities. With the T-type equivalent circuit being extracted and verified, the waveform along bent transmission line in a high-speed digital circuit is simulated to demonstrate the signal integrity effect of the single bend.
Because the differential signaling has the property of low noise generation and the high immunity to common-mode noise, it has become a popular option for multi-gigabit digital applications. The signal integrity analyses for bent differential transmission lines in a high-speed digital circuit are therefore performed in the time domain. One practical compensation scheme, the dual back-to-back bends, for the common-mode noise reduction are further investigated. To alleviate the common-mode noise at the receiver, a novel compensation scheme in use of the bump delay line is also proposed. However, the most important contribution in this thesis is to provide the complete flows of designing bump delay lines so that the designer could follow the steps of the proposed method to design a perfect and practical bump while both keeping good SI and using least layout space.
Finally, the comparison between the simulation and measured results validates the analysis approach of differential bends with the proposed bump delay lines.
Subjects
轉角
延遲線
共模雜訊
Bend
Delay line
Common mode noise
Type
thesis
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