Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

1

Pages

147-153

Date Issued

2006

Author(s)

Liu, Y.U.-C.

Lin, W.-H.

Lin, H.-J.

Chuang, T.-H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-006-0197-7

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492016

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644433535&doi=10.1007%2fs11664-006-0197-7&partnerID=40&md5=8d5530354367967b19aa971a54f5a6d0

Type

conference paper