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Flip-Chip-Assembled <formula formulatype="inline"> <tex Notation="TeX">$W$</tex></formula>-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration
Journal
IEEE Transactions on Microwave Theory and Techniques
Journal Volume
60
Journal Issue
3
Pages
766--777
Date Issued
2012-03
Author(s)
Hsin-Chia Lu
Che-Chung Kuo
Po-An Lin
Chen-Fang Tai
Yi-Long Chang
Yu-Sian Jiang
Jeng-Han Tsai
Yue-Ming Hsin
Huei Wang
Type
journal article