Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

1

Pages

154-164

Date Issued

2006

Author(s)

Lin, H.-J.

Chuang, T.-H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-006-0198-6

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492012

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644450074&doi=10.1007%2fs11664-006-0198-6&partnerID=40&md5=b643cb0a8fb2b4162878c11b2fb9941f

Type

conference paper