Investigation and Analysis of Thermoelectric Cooling Module
Date Issued
2006
Date
2006
Author(s)
Ye, Zheng-Hong
DOI
zh-TW
Abstract
The growth of chip performance and manufacturing technology results in high power dissipation and high operating temperature. Thermoelectric cooling device is suitable for electronic cooling with the advantages of sensitive temperature control and small size. This paper presents a theoretical analysis of the performance of thermoelectric cooler (TEC), and an experimental methodology for the thermoelectric parameters. The performance experiment result shows that COP of the TEC is greater than 1 if the temperature difference between cold and hot side of thermoelectric cooler is less than 10℃. Then TEC is applied into air cooling module or water cooling module to become TEC air cooling module or TEC water cooling module. The influences of heating power, input electrical current and heat source area on the performance of cooling module are investigated by means of thermal resistance model. Then the applicative range is given. The experimental result shows the total thermal resistance increases with the increasing heating power; while applying a fixed heating power there exists an optimum input current that the total thermal resistance is minimum, in water TEC module the optimum current is about 6~7A and the lowest total thermal resistance is -1.05℃/W. The water cooling module with TEC works better than which without TEC until heating power reaches 75W. It is found that there exists extra heat absorbed from the environment due to the difference of heat source area and TEC cold side area. The experimental result fits well with the theoretical analysis of thermal resistance model under the circumstances of good heat insulation of the rest area of TEC cold side that is not contacted with the heat source and uniform temperature of heat sink area that is contacted with the hot side of TEC. So the theoretical analysis provides a quite consonant prediction of the performance of TEC cooling module with operating conditions close to the former twos.
Subjects
熱電製冷
熱阻模型
合適操作範圍
Thermoelectric cooling
Thermal resistance model
Applicative range
Type
thesis
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