Study on Press-Casting of Silicon Wafer
Date Issued
2014
Date
2014
Author(s)
Chou, Qi-Rui
Abstract
As the cost of silicon solar module is near $0.50/Wp, silicon wafers remain the major cost. However, to produce the wafers from ingot growth, the cost for slicing and kerf-loss silicon is still very high. Therefore, the kerf-free wafer casting technology has attracted much attention recently. Labrotary propose a novel single wafer press-casting technique to do experiment. First, a prototype system has been developed. The effects of major control parameters, such as the temperature difference, pressing speed, and the substrate materials, on the wafer shape, thickness, uniformity, and grain orientation were examined for tin and silicon. Some preliminary results were obtained and the feasibility of the technique was discussed. In addition, press-casting silicon wafers will analyse grain orientation and grain boundary by EBSD, then compare it to silicon ribbons of other grown methods.
Subjects
太陽能
切割成本
矽晶片
壓合鑄造
矽晶帶
Type
thesis
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ntu-103-R00524059-1.pdf
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