Novel Cu-RuNx composite layer with good solderability and very low consumption rate
Resource
Journal of Alloys and Compounds, 504(2), L25-L27
Journal
Journal of Alloys and Compounds
Journal Volume
504
Journal Issue
2
Pages
-
Date Issued
2010
Date
2010
Author(s)
Abstract
This letter reports a RuNx-bearing Cu layer that has the potential to replace both the wetting layer and the diffusion barrier layer in the conventional under bump metallurgy of flip-chip solder joints. This Cu-RuNx composite layer was deposited by reactive co-sputtering of Cu and Ru in N2 atmosphere. Experimental characterizations show that Cu-RuNx exhibits comparable solderability to pure Cu. Most importantly, Cu-RuNx has a dissolution rate at least one order of magnitude slower than that of pure Cu. A single layer exhibiting these two attributes might offer substantial advantage in cost reduction. © 2010 Elsevier B.V.
Type
journal article
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