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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Microstructure-thermal properties of Cu/Al 2O 3 bilayer prepared by direct bonding
Details
Microstructure-thermal properties of Cu/Al 2O 3 bilayer prepared by direct bonding
Journal
Journal of the European Ceramic Society
Journal Volume
33
Journal Issue
2
Pages
277-285
Date Issued
2013
Author(s)
Lee, S.-K.
Tuan, W.-H.
Wu, Y.-Y.
Shih, S.-J.
WEI-HSING TUAN
DOI
10.1016/j.jeurceramsoc.2012.09.015
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/492172
URL
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84868350813&doi=10.1016%2fj.jeurceramsoc.2012.09.015&partnerID=40&md5=52136834613eed876f603b325ed599e6
Type
journal article