Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
Journal
Journal of Electronic Materials
Journal Volume
33
Journal Issue
7
Pages
L18-L18
Date Issued
2004
Author(s)
Type
journal article