Routing for chip-package-board co-design considering differential pairs

Journal

IEEE/ACM International Conference on Computer-Aided Design

Pages

512-517

Date Issued

2008

Author(s)

Fang, J.-W.

Ho, K.-H.

DOI

10.1109/ICCAD.2008.4681623

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-57849143787&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/341021

SDGs

[SDGs]SDG9

Type

conference paper